In this lab we learned how to solder.
The process of soldering is explained as follows:
1. Soldering Lap Joints
Lap joints involve soldering two overlapped pieces of wire
Use a wire stripper to remove about 1/2in of insulation from each wire end. Lightly twist the strands together so they don't fray during tinning. Heat the wire with the soldering iron. Feed solder into the wire until it’s evenly coated with a thin, shiny layer. Do this for both wires to be joined. Lay one tinned wire over the other to form the lap joint. apply a little extra solder to the soldering iron tip Place both wires on the the soldering iron tip and remove them while keeping the joint steady, so it cools evenly A solid joint should be smooth, shiny, and cover both wires completely.
🔌 2. Through-Hole Soldering
Straighten and clean the leads if needed. Apply a small amount of flux to the leads. Heat each lead with the soldering iron and apply a bit of solder. Leads should be lightly coated with a thin, shiny layer. Clean and tin the PCB holes: Heat the hole area with your iron and apply a small amount of solder so the pad is pre-tinned. Do the same with the wire to tin it Insert the component into the board: Place the tinned leads through the matching tinned holes. Work from the solder side of the board (the side with exposed pads). Heat the pad and the lead: Touch the iron tip to both the lead and the copper pad simultaneously. Touch solder to the heated joint (not directly to the iron). Allow solder to flow smoothly and form a cone shape. Remove solder and then the iron: Stop feeding solder, then lift the iron off cleanly. Let the joint cool naturally: Do not move the component while the solder is solidifying. Should look shiny and cone-shaped, with full coverage around the lead. Use flush cutters to trim the leads close to the solder joint. 
