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Lab 04 - Soldering

Overview:

This lab re-visits the concept of soldering and builds upon our previous knowledge and skill of it. Soldering is a metal-joining process that uses solder to create an electrical or mechanical bond between two or more items. The solder has a lower melting point than the metal being joined. Within this lab we created a lap joint between two wires, then proceeded to create a through hole PCB (printed circuit board).

Lap Joint:

The lap joint process consists of:

1: Taking 2, 24 gauge wires and stripping off about half an inch of insulation off each end.

2: Ensuring the soldering station is ready to solder (solder iron is prepped, sponge is soaked with RO water, and solder is ready to be applied).

3: The process of tinning the wires is begun

Tinning is the process of applying solder onto an individual wire to strengthen the exposed end. This bonds the individual strands of wire together, and allows the soldering process to be more efficient. This also prevents fraying, and increases conductivity.

4: Now the lap joint is created with soldering. One exposed wire is placed on top of the other, and while applying solder to the soldering iron, the solder will proceed to jump onto the exposed wires. This step can be complicated, and focus is needed for this part.

5: At this point, the liquid solder is applied evenly over the wires, and once that is fulfilled, the wires are taken away from the iron and cooled to create the final bond.

6: Finally, the lap joint should be complete. It should consist of a shiny, smooth surface, with no fractures and impurities.

Reflection:

This actually went pretty well under initial first looks. I applied the solder to the iron then proceeded to solder the wires. The solder jumped from the iron to the wires where I then proceeded to coat them effectively. However, once I looked underneath a magnifying glass, I noticed that there were mini fractures in the connection, due to me moving during the cooling period. There was also a stray wire, so I proceeded to try this again. This time, the connection was shinier and smoother, and it completely covered all the wires. Prof. Rose said it was a very solid solder. The reason it went better this time around is due to me staying more still during the cooling process, and I was more careful when stripping the wires.

Initial solder

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Final Solder

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Through Hole PCB:

The through hole PCB process consists of:

1: Identifying the top and bottom of the PCB

2: Taking the resistor and inserting the leads into the PCB board.

3: Setting up the resistor in such a way that it will not move during the soldering process. For this, I slightly bent the end of the leads so they held in place.

4: Once the setup was complete, the solder was held onto the point of connection, and heat was applied to the area with the iron. Once the solder began to flow, I monitored the amount used.

5: When completed, The hole and surface should be completely coated through with a shiny finish. The bottom should have a volcano esque shape to it.

Reflection:

My first instance trying this, I was not aware of how much or how little solder I should use. Unfortunately, I made mountains on either side and used way too much solder. I tried this process again, this time ensuring I used the proper amount of solder and made the volcanic shape. Everything looked good with this solder, except that my heat was a little too high. I needed to balance my time and temperature better in order to get the best solder. As a reflection, I must next time lower the temperature slightly, and apply the iron for a slightly longer time to ensure full coverage.

What I learned through this lab:

One must pay attention on controlling the heat, using the right amount of flux, and being careful not to damage the board. This is done by minimizing the contact time with the board and solder.

Final Through Hole PCB Solder:

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