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Lab 04 - Soldering
In lab we learned how to solder two different types of joints. First the Lap joint, then the through hole of PCB.
When setting up to complete a lap joint, the insulation of the wires is first stripped 1/4”.
The tips of the wires are then tinned, which is where a thin layer of solder is melted on the stripped portion of the wire.
while holding the two pieces together, solder is melted on with the iron, connecting the sections and making a joint.
When starting a Through Hole on PCB, start by selecting a resistor and hole in the PCB. Legs of the resistor are placed through the holes and slightly bent to retain position. Heat is applied to the backside of the PCB (opposite the head of the resistor) and a small amount of solder is added. The goal is to have a volcano shape of solder on the joint to ensure a solid connection.
After manufacturing these two joints, I learned a couple things. First, tinning the wires on the lap joint is very important in creating a good joint. Adding too much solder is also something to be careful of and can add lots of additional weight across hundreds of joints in the system. When I solder again, I think I will try to find a way to keep the joint stable, like by using a helping hand, to avoid movement and microfractures in the joint. This would also help putting the solder in the exact spot I want. On the PCB through hole, I would investigate if a better heat setting for the iron is better at keeping the board from melting, while also having the necessary heat melt the solder.
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