reached US$ 8.2 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 11.5 Billion by 2028, exhibiting a growth rate (CAGR) of 5.5% during 2023-2028.
Printed circuit boards (PCBs) integrated with high-density interconnects (HDIs) represent the circuit boards having an enhanced wiring density per unit than conventional boards. With blind and buried vias, it consists of micro-vias that are smaller in diameter and have a somewhat greater pad density than traditional course boards while having an increased circuitry density than conventional counterparts. High-density PCB technology has entitled engineers improved design freedom and flexibility, thus allowing them to place smaller and closer components, which reduces crossing delays and signal loss. In addition, it gives designers more surface area to work with, adequate cue quality, and faster signal transmission. As a result, high-density interconnect PCBs find widespread applications across various sectors, such as computers, consumer electronics, automotive, telecom or datacom, etc.
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Note: We are regularly tracking the direct effect of COVID-19 on the market, along with the indirect influence of associated industries. These observations will be integrated into the report.
High-Density Interconnect (HDI) PCB Market Trends and Drivers:
The escalating product demand across several electronic devices, including touch-screen devices, mobile phones, laptops, computers, and digital cameras, is among the primary factors driving the high-density interconnect (HDI) PCB market. Besides this, the higher uptake of medical devices and equipment, owing to the rising healthcare expenditure, is further augmenting the market growth. Moreover, the emerging trend of electronic device miniaturization and the elevating requirement for high-performance gadgets are also catalyzing the global market. Apart from this, the increasing production rates of aircraft parts and components are acting as significant growth-inducing factors. Furthermore, the utilization of sophisticated safety systems, the growing popularity of autonomous driving, high sales of smart devices and gaming consoles, inflating disposable income levels, and the extensive research and development (R&D) activities are anticipated to propel the high-density interconnect (HDI) PCB market over the forecasted period.
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High-Density Interconnect (HDI) PCB Market 2023-2028 Analysis and Segmentation:
The competitive landscape of the market has been studied in the report with the detailed profiles of the key players operating in the market.
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Bittele Electronics Inc., Fineline Ltd., Meiko Electronics Co. Ltd., Millennium Circuits Limited, Mistral Solutions Pvt. Ltd., Shenzhen Kinwong Electronic Co. Ltd., Sierra Circuits, TTM Technologies Inc., Unimicron Technology Corporation (United Microelectronics Corporation), Unitech Printed Circuit Board Corp. and Würth Elektronik GmbH & Co. KG.
The report has segmented the market on the basis of number of HDI layer and end use industry.
Breakup by Number of HDI Layer:
4-6 Layers HDI PCBs
8-10 Layer HDI PCBs
10+ Layer HDI PCBs
Breakup by End Use Industry:
Smartphones and Tablets
Breakup by Region:
North America: (United States, Canada)
Asia Pacific: (China, Japan, India, South Korea, Australia, Indonesia, Others)
Europe: (Germany, France, United Kingdom, Italy, Spain, Russia, Others)
Latin America: (Brazil, Mexico, Others)
Middle East and Africa
Key highlights of the report:
Market Performance (2017-2022)
Market Outlook (2023-2028)
Porter's Five Forces Analysis
Market Drivers and Success Factors
Comprehensive Mapping of the Competitive Landscape
If you need specific information that is not currently within the scope of the report, we can provide it to you as a part of the customization.
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